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How to manage high-density HDI holes
Just as hardware stores need to manage and display nails and screws of various types, metric, material, length, width and pitch, etc., PCB design also needs to manage design objects such as holes, especially in high-density design. Traditional PCB designs may only use a few different pass holes, ...
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How to place capacitors in PCB design?
Capacitors play an important role in high-speed PCB design and are often the most used device on PCBS. In PCB, capacitors are usually divided into filter capacitors, decoupling capacitors, energy storage capacitors, etc. 1.Power output capacitor, filter capacitor We usually refer to the capacitor...
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Advantages and disadvantages of pcb copper coating
Copper coating, that is, the idle space on the PCB is used as the base level, and then filled with solid copper, these copper areas are also called copper filling. The significance of copper coating is to reduce the ground impedance and improve the anti-interference ability. Reduce voltage drop, ...
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Electroplated Hole Sealing/Filling On Ceramic PCB
Electroplated hole sealing is a common printed circuit board manufacturing process used to fill and seal through holes (through-holes) to enhance electrical conductivity and protection. In the printed circuit board manufacturing process, a pass-through hole is a channel used to connect different ...
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Why should PCB boards do impedance?
PCB impedance refers to the parameters of resistance and reactance, which plays anobstruction role in alternating current. In pcb circuit board production, impedance treatment is essential. So do you know why PCB circuit boards need to do impedance? 1, PCB circuit board bottom to consider the ins...
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poor tin
PCB design and production process has as many as 20 processes, poor tin on the circuit board may lead to such as line sandhole, wire collapse, line dog teeth, open circuit, line sand hole line; Pore copper thin serious hole without copper; If the hole copper thin is serious, the hole copper witho...
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Key points for grounding booster DC/DC PCB
Often hear “grounding is very important”, “need to strengthen the grounding design” and so on. In fact, in the PCB layout of booster DC/DC converters, grounding design without sufficient consideration and deviation from the basic rules is the root cause of the problem. Be ...
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Causes of poor plating on circuit boards
1. Pinhole The pinhole is due to the adsorption of hydrogen gas on the surface of the plated parts, which will not be released for a long time. The plating solution cannot wet the surface of the plated parts, so that the electrolytic plating layer cannot be electrolytically analyzed. As the thick...
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How to select suitable PCB surface to get longer service life?
Circuit materials rely on high-quality conductors and dielectric materials to connect modern complex components to each other for optimal performance. However, as conductors, these PCB copper conductors, whether DC or mm Wave PCB boards, need anti-aging and oxidation protection. This protection c...
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Introduction to reliability testing of PCB circuit boards
The PCB circuit board can combine many electronic components together, which can save space very well and will not hinder the operation of the circuit. There are many processes in the design of the PCB circuit board. First, we need to set Check the parameters of the PCB circuit board. Second, we ...
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What points should be paid attention to in DC-DC PCB design?
Compared with LDO, the circuit of DC-DC is much more complex and noisy, and the layout and layout requirements are higher. The quality of layout directly affects the performance of DC-DC, so it is very important to understand the layout of DC-DC 1. Bad layout ●EMI, DC-DC SW pin will have higher d...
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Development Trend of Rigid-Flexible PCB Manufacturing Technology
Due to different types of substrates, the manufacturing process of rigid-flex PCB is different. The main processes that determine its performance are thin wire technology and microporous technology. With the requirements of miniaturization, multi-function and centralized assembly of electronic pr...
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