In 2023, the value of the global PCB industry in US dollars fell by 15.0% year-on-year
In the medium and long term, the industry will maintain stable growth. The estimated compound annual growth rate of global PCB output from 2023 to 2028 is 5.4%. From a regional perspective, the #PCB industry in all regions of the world has shown a continuous growth trend. From the perspective of product structure, the packaging substrate, high multi-layer board with 18 layers and above, and HDI board will maintain a relatively high growth rate, and the compound growth rate in the next five years will be 8.8%, 7.8%, and 6.2%, respectively.
For packaging substrate products, on the one hand, artificial intelligence, cloud computing, intelligent driving, the Internet of everything and other products technology upgrade and application scenario expansion, driving the electronics industry to high-end chips and advanced packaging demand growth, thus driving the global packaging substrate industry to maintain long-term growth. In particular, it has promoted the high level packaging substrate products used in high computing power, integration and other scenarios to show a high growth trend. On the other hand, the domestic increase in support for the development of the semiconductor industry, and the increase in related investment will further accelerate the development of the domestic packaging substrate industry. In the short term, as end-manufacturer semiconductor inventories gradually return to normal levels, the World Semiconductor Trade Statistics Organization (hereinafter referred to as “WSTS”) expects the global semiconductor market to grow by 13.1% in 2024.
For PCB products, markets such as server and data storage, communications, new energy and intelligent driving, and consumer electronics will continue to be important long-term growth drivers for the industry. From the cloud perspective, with the accelerated evolution of artificial intelligence, the ICT industry’s demand for high computing power and high-speed networks is becoming increasingly urgent, driving the rapid growth of demand for large-size, high-level, high-frequency and high-speed, high-level HDI, and high-heat PCB products. From the terminal point of view, with AI in mobile phones, PCS, smart wear, IOT and other production
With the continuous deepening of the application of products, the demand for edge computing capabilities and high-speed data exchange and transmission in various terminal applications has ushered in explosive growth. Driven by the above trend, the demand for high frequency, high speed, integration, miniaturization, thin and light, high heat dissipation and other related PCB products for terminal electronic equipment continues to grow.