The design points of the hard-soft fusion board of pcb circuit board


1. For power circuits that must be repeatedly bent, it is best to choose a single-sided soft structure, and choose RA copper to improve fatigue life.

 2. It is proposed to maintain the inner electrical layer wiring of the bonding wire to bend along the vertical direction. But sometimes it cannot be done. Please avoid the bending force and frequency as much as possible. You can also choose the taper bending according to the mechanical structure design regulations.

3. It is best to prevent the use of oblique angles that are too abrupt or 46° angle wiring that will physically attack, and arc-angle wiring schemes are often used. That way, the ground stress of the inner electric layer can be reduced during the whole bending process.

4. There is no need to change the size of the wiring suddenly. The sudden change of the wiring pattern boundary or the connection to the solder layer will cause the foundation to be weak and the top priority.

5. Ensure structural reinforcement for the welding layer. Considering the choice of low-viscosity adhesive (relative to F6-4), the copper on the bonding wire is easier to get rid of the polyimide film-based steel sheet. Therefore, it is very important to ensure the structural reinforcement of the exposed inner electrical layer. The buried holes of the composite wear-resistant plate ensure proper guidance for the two soft layers, so the use of pads is a very good structural reinforcement solution.

6. Maintain softness on both sides. For dynamic double-sided bonding wires, try to avoid placing wiring in the same direction as much as possible, and it is often necessary to separate them to make the inner electrical layer wiring evenly distributed.

7. It is necessary to pay attention to the bending radius of the flexible board. If the bending radius is too heavy, it will be easily destroyed.

 8. Reasonably reduce the area, and the reliability design reduces the cost.

9. Attention must be paid to the structure of the space structure after assembly.