The basic introduction of SMT patch processing
The assembly density is high, the electronic products are small in size and light in weight, and the volume and component of the patch components are only about 1/10 of the traditional plug-in components
After the general selection of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.
High reliability and strong vibration resistance. Low defect rate of solder joint.
Good high frequency characteristics. Reduced electromagnetic and RF interference.
Easy to achieve automation, improve production efficiency. Reduce the cost by 30%~50%. Save data, energy, equipment, manpower, time, etc.
Why use Surface Mount Skills (SMT)?
Electronic products seek miniaturization, and the perforated plug-in components that have been used can no longer be reduced.
The function of electronic products is more complete, and the integrated circuit (IC) selected has no perforated components, especially large-scale, highly integrated ics, and surface patch components have to be selected
Product mass, production automation, the factory to low cost high output, produce quality products to meet customer needs and strengthen market competitiveness
The development of electronic components, the development of integrated circuits (ics), the multiple use of semiconductor data
Electronic technology revolution is imperative, chasing the world trend
Why use a no-clean process in surface mount skills?
In the production process, the waste water after the product cleaning brings pollution of water quality, earth and animals and plants.
In addition to water cleaning, use organic solvents containing chlorofluorocarbons (CFC&HCFC)Cleaning also causes pollution and damage to the air and atmosphere. The residue of cleaning agent will cause corrosion on the machine board and seriously affect the quality of the product.
Reduce cleaning operation and machine maintenance costs.
No cleaning can reduce the damage caused by PCBA during movement and cleaning. There are still some components that cannot be cleaned.
The flux residue is controlled and can be used in accordance with product appearance requirements to prevent visual inspection of cleaning conditions.
The residual flux has been continuously improved for its electrical function to prevent the finished product from leaking electricity, resulting in any injury.
What are the SMT patch detection methods of the SMT patch processing plant?
Detection in SMT processing is a very important means to ensure the quality of PCBA, the main detection methods include manual visual detection, solder paste thickness gauge detection, automatic optical detection, X-ray detection, online testing, flying needle testing, etc., due to the different detection content and characteristics of each process, the detection methods used in each process are also different. In the detection method of smt patch processing plant, manual visual detection and automaticOptical inspection and X-ray inspection are the three most commonly used methods in surface assembly process inspection. Online testing can be both static testing and dynamic testing.
Global Wei Technology gives you a brief introduction to some detection methods:
First, manual visual detection method.
This method has less input and does not need to develop test programs, but it is slow and subjective and needs to visually inspect the measured area. Due to the lack of visual inspection, it is rarely used as the main welding quality inspection means on the current SMT processing line, and most of it is used for rework and so on.
Second, optical detection method.
With the reduction of PCBA chip component package size and the increase of circuit board patch density, SMA inspection is becoming more and more difficult, manual eye inspection is powerless, its stability and reliability is difficult to meet the needs of production and quality control, so the use of dynamic detection is becoming more and more important.
Use automated optical inspection (AO1) as a tool to reduce defects.
It can be used to find and eliminate errors early in the patch processing process to achieve good process control. AOI uses advanced vision systems, novel light feed methods, high magnification and complex processing methods to achieve high defect capture rates at high test speeds.
AOl’s position on the SMT production line. There are usually 3 kinds of AOI equipment on the SMT production line, the first is AOI that is placed on the screen printing to detect the solder paste fault, which is called post-screen printing AOl.
The second is an AOI that is placed after the patch to detect device mounting faults, called post-patch AOl.
The third type of AOI is placed after reflow to detect device mounting and welding faults at the same time, called post-reflow AOI.
