SMT skills 丨 component placement rules

 

In PCB design, the layout of components is one of the important links. For many PCB engineers, how to lay out components reasonably and effectively has its own set of standards. We summed up the layout skills, roughly the following 10 The layout of electronic components needs to be followed!

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1. Follow the layout principle of “big first, then small, difficult first, easy first”, that is, important unit circuits and core components should be laid out first.

2. The principle block diagram should be referred to in the layout, and the main components should be arranged according to the main signal flow of the board.

3. The arrangement of components should be convenient for debugging and maintenance, that is, large components cannot be placed around small components, and there should be enough space around components that need to be debugged.

4. For the circuit parts of the same structure, use the “symmetrical” standard layout as much as possible.

5. Optimize the layout according to the standards of uniform distribution, balanced center of gravity, and beautiful layout.

6. The same type of plug-in components should be placed in one direction in the X or Y direction. The same type of polarized discrete components should also strive to be consistent in the X or Y direction to facilitate production and inspection.

Circuit board factory

 

7. The heating elements should generally be evenly distributed to facilitate the heat dissipation of the veneer and the whole machine. Temperature sensitive devices other than the temperature detection element should be kept away from the components that generate large amounts of heat.

8. The layout should meet the following requirements as far as possible: the total connection is as short as possible, and the key signal line is the shortest; high voltage, large current signal and low current, low voltage weak signal are completely separated; analog signal and digital signal are separated; high frequency signal Separate from low-frequency signals; the spacing of high-frequency components should be sufficient.

9. The layout of the decoupling capacitor should be as close as possible to the power supply pin of the IC, and the loop between it and the power supply and ground should be the shortest.

10. In the component layout, appropriate consideration should be given to placing the devices using the same power supply together as much as possible to facilitate future power supply separation.