PCB process edge

The PCB process edge is a long blank board edge set for the track transmission position and placement of imposition Mark points during SMT processing. The width of the process edge is generally about 5-8mm.

In the PCB design process, due to some reasons, the distance between the edge of the component and the long side of the PCB is less than 5mm. In order to ensure the efficiency and quality of the PCB assembly process, the designer should add a process edge to the corresponding long side of the PCB

PCB process edge considerations：

1. SMD or machine-inserted components cannot be arranged in the craft side, and the entities of the SMD or machine-inserted components cannot enter the craft side and its upper space.

2. The entity of the hand-inserted components cannot fall in the space within 3mm height above the upper and lower process edges, and cannot fall in the space within 2mm height above the left and right process edges.

3. The conductive copper foil in the process edge should be as wide as possible. Lines less than 0.4mm require reinforced insulation and abrasion-resistant treatment, and the line on the most edge is not less than 0.8mm.

4. The process edge and the PCB can be connected with stamp holes or V-shaped grooves. Generally, V-shaped grooves are used.

5. There should be no pads and through holes on the edge of the process.

6. A single board with an area greater than 80 mm² requires that the PCB itself have a pair of parallel process edges, and no physical components enter the upper and lower spaces of the process edge.

7. The width of the process edge can be appropriately increased according to the actual situation.