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FPC hole metallization and copper foil surface cleaning process
Hole metallization-double-sided FPC manufacturing process The hole metallization of flexible printed boards is basically the same as that of rigid printed boards. In recent years, there has been a direct electroplating process that replaces electroless plating and adopts the technology of forming...
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Why does the PCB have holes in the hole wall plating?
Treatment before copper sinking 1. Deburring: The substrate goes through a drilling process before copper sinking. Although this process is prone to burrs, it is the most important hidden danger that causes metallization of inferior holes. Must adopt deburring technological method to solve. Usual...
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How much do you know about crosstalk in high-speed PCB design
In the learning process of high-speed PCB design, crosstalk is an important concept that needs to be mastered. It is the main way for the propagation of electromagnetic interference. Asynchronous signal lines, control lines, and I\O ports are routed. Crosstalk can cause abnormal functions of circ...
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Have you done everything right to balance the PCB stackup design method?
The designer may design an odd-numbered printed circuit board (PCB). If the wiring does not require an additional layer, why use it? Wouldn’t reducing layers make the circuit board thinner? If there is one less circuit board, wouldn’t the cost be lower? However, in some cases, adding ...
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How to break the PCB electroplating sandwich film problem?
With the rapid development of the PCB industry, PCB is gradually moving towards the direction of high-precision thin lines, small apertures, and high aspect ratios (6:1-10:1). The hole copper requirements are 20-25Um, and the DF line spacing is less than 4mil. Generally, PCB production companies ...
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The function and characteristics of PCB gong board machine
The PCB gong board machine is a machine used to divide the irregular PCB board connected with the stamp hole. Also called PCB curve splitter, desktop curve splitter, stamp hole PCB splitter. The PCB gong board machine is an important process in the PCB production process. The PCB gong board refer...
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What are the spacing requirements for designing PCB circuit boards?
—Edited by JDB PCB COMPNAY. PCB engineers often encounter various safety clearance issues when doing PCB design. Usually these spacing requirements are divided into two categories, one is electrical safety clearance, and the other is non-electrical safety clearance. So, what are the ...
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You still don’t know the number of PCB layers? That’s because these methods are not mastered!
01 How to see the number of pcb layers Since the various layers in the PCB are tightly integrated, it is generally not easy to see the actual number, but if you carefully observe the board fault, you can still distinguish it. Careful, we will find that there is one or several layers of white mat...
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In 2020, China’s PCB exports reached 28 billion sets, a record high in the past ten years
Since the beginning of 2020, the new crown epidemic has raged around the world and has had an impact on the global PCB industry. China analyzes the monthly export volume data of China’s PCB released by the General Administration of Customs. From March to November 2020, China’s PCB exp...
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Analysis of PCB application in the server field
Printed Circuit Boards (PCBs for short), which mainly provide electrical connections for electronic components, are also called “the mother of electronic system products.” From the perspective of the industrial chain, PCBs are mainly used in communication equipment, computers and peri...
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Automotive chips are out of stock Automotive PCBs are hot?
The shortage of automotive chips has recently become a hot topic. Both the United States and Germany hope that the supply chain will increase the output of automotive chips. In fact, with limited production capacity, unless a good price is difficult to refuse, it is almost impossible to urgently ...
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What is PCB stackup? What should be paid attention to when designing stacked layers?
Nowadays, the increasingly compact trend of electronic products requires the three-dimensional design of multilayer printed circuit boards. However, layer stacking raises new issues related to this design perspective. One of the problems is to obtain a high-quality layered build for the project. ...
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