In PCB manufacturing quality control, several aspects should be checked to ensure that the final product meets the required quality standards. These aspects include:
1. Quality of chip placement: Check if the surface mount components are correctly installed, whether the pads and pins are correctly aligned, and other relevant factors.
2. Thickness control: Check the thickness of the PCB, ensuring it meets the required specifications.
3. Process control: Verify that each process during the manufacturing process meets the required specifications, such as temperature and time for chemical copper plating processes.
4. Welding quality: Inspect the quality of the solder joint, including short circuits, hole filling, and residues, among other aspects.
5. Pathway continuity: Ensure that the wire and holes on the board are open and clear, including drill holes and mounting holes.
6. Appearance quality: Check the PCB’s appearance quality, including scratches, cracks, and deformations, among other aspects.
7. Fusion (solder mask and silkscreen): Verify that PCB’s solder mask and silkscreen are correctly applied, including the clarity and legibility of the text.
8. Packaging quality: Inspect the PCB’s packaging quality, including whether it is intact and moisture-resistant.
Checking these essential aspects during PCB manufacturing quality control is critical to avoid defects and ensure that the final product meets the required specifications. By employing proper quality control measures, PCB manufacturers can improve the quality and reliability of their products, reducing potential defects and minimizing costs associated with rework and recalls.