1. DIP package

DIP package (Dual In-line Package), also known as dual in-line packaging technology, refers to integrated circuit chips that are packaged in dual in-line form. The number generally does not exceed 100. A DIP packaged CPU chip has two rows of pins that need to be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering. DIP-packaged chips should be plugged and unplugged from the chip socket with special care to avoid damage to the pins. DIP package structure forms are: multi-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (including glass ceramic sealing type, plastic packaging structure type, ceramic low melting glass packaging type)

DIP package has the following characteristics:

1. Sutable for perforation welding on PCB (printed circuit board), easy to operate;

2. The ratio between the chip area and the package area is large, so the volume is also large;

DIP is the most popular plug-in package, and its applications include standard logic IC, memory and microcomputer circuits. The earliest 4004, 8008, 8086, 8088 and other CPUs all used DIP packages, and the two rows of pins on them can be inserted into the slots on the motherboard or soldered on the motherboard.