Big discounting Multilayer PCB Circuit Board Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics
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SHENZHEN Electronic Multilayer PCB Circuit Board
Based in Shenzhen, Shenzhen Fastline Circuits Ltd specialize in electronic design, PCB manufacture, PCB assembly, and component sourcing services, also could provide:
- PCB&PCBA Contract Manufacturing
- Reverse Engineering Services
- PCB Design and Assembly
- Component Procurement & Material Management
- Product Design
- Fast PCB&PCBA Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
- AOI,X-Ray Testing, other Function Testing Service
Process Capability
PCB (PCB Assembly) process capability:
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology | |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
| PCB Assembly With UL,CE,FCC,Rohs Approval | |
| Nitrogen gas reflow soldering technology for SMT | |
| High Standard SMT&Solder Assembly Line | |
| High density interconnected board placement technology capacity | |
| Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly | |
| To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders. | |
| Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
| OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
| PCBA and enclosure design | |
| Components sourcing and purchasing | |
| Quick prototyping | |
| Plastic injection molding | |
| Metal sheet stamping | |
| Final assembly | |
| Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
| Custom clearance for material importing and product exporting | |
| Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Reflow Oven: FolunGwin FL-RX860 | |
| Wave Soldering Machine: FolunGwin ADS300 | |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
| Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
Products Details
| Number of layers | 1-50layers |
| Material | FR4 (TG) |
| Plate thickness | 0.1-18mm |
| Type | Immersion Silver |
| Min. hole | 0.1 mm |
| Sample delivery | 5-6days |
| Solder Mask | Green,Black,Blue,Red,Matt Green |
| Max Layer | 50L |
| Service | 24Hours technical services |
| PCB Standard | IPC-A-600 |
- Supply Ability:
- 50000 Square Meter/Square Meters per Year
- Packaging Details
- Vacuum packaging and carton
- Port
- Shenzhen
- Lead Time :
-
Quantity(Pieces) 1 – 1000 >1000 Est. Time(days) 21 To be negotiated
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